QSFP-DD PCB board,8Layer Plus 2 HDI, gold finger,100G material
Telecommunication and data center customers have increasing bandwidth requirements and, therefore, require high-density interconnects. QSFP-DD Interconnect System enables faceplate density equal to the current 2x1 QSFP form factor, but with 8-lane ports. In other words, a total of 256 differential pairs with 32 ports delivers double-lane density within the same form factor. Our PCB manufacturing capabilities enable us to produce a wide range of products, We can make just about any printed circuit board you can think of including HDI PCB, Multilayer PCBs (up to 40layers),High-tech PCB, Thick Copper PCB, Halogen PCB as standard options, and more special PCBs such as Flex-Rigid PCB, aluminum PCB and Rogers PCB.
- Multi-layer PCBs Capability (1 to 40L)
- Controlled Impedance Circuit Boards
- 100% Electrical Testing
- 3 mil Traces/3 mil Spaces
- FR4,Roger,Teflon and others
- Maximum Panel Size: 19.7" x 31.5"
- High Density Interconnect PCBs
- Blind, Buried and Plugged Vias
- Smallest Hole size: 0.1mm/0.004"/4mil
- Lead-Free compliant PCBs
1.Product application
Optical module
QSFP-DD(Quad Small Form-factor Pluggable-Double Density) has a four-channel SFP-DD interface, a single-channel transmission rate of 56Gbps, and a transmission rate of 100Gbps. It is applicable to high-performance switch, router, server and host bus adapter in calculation and telecom application, with enterprise storage, high density, high-speed I/O, and multi-channel interconnection.
2 . Specifications:
| Name |
QSFP-DD PCB board |
| Layers |
8 |
| Quality Grade |
IPC 6012 Class 2,IPC 6012 Class 3 |
| Material |
Tachyon 100G |
| Thickness |
1.0mm |
| Min Track/Spacing |
75um/75um |
| Drilling Size |
0.15mm |
| Solder Mask |
Green |
| Silkscreen |
White |
| Surface Finish |
Immersion gold + ENEPIG |
| Finished Copper |
12um |
| Production time |
10-21 working days |
| Lead time |
2-3 days
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Product Tags:
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Gold Finger QSFP DD Pcb Fabrication Services Images
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